Electroless nickel immersion gold Wikipedia
Electroless nickel immersion gold (ENIG) is a metal plating process used in the manufacture of printed circuit boards (PCBs) to avoid oxidation and improve the solderability of copper contacts and plated throughholes.It consists of an electroless nickel plating covered with a thin layer of gold which protects the nickel from oxidation.The gold is typically applied by quick immersion in a
China Immersion Gold Immersion Gold Manufacturers
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IPC4552 for ENIG Final Finish
Electroless Nickel/Immersion Gold (ENIG) per IPC4552 or follow table below Note IPC cautions that gold thickness above 4.925 µ" can indicate increased risk of having compromised the integrity of the nickel undercoat due to excessive corrosion.
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Immersion Gold PCB Kingford
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Immersion gold plating vs. electroless gold plating
ECIG (Electroless Copper Immersion gold) is about as expensive as ENIG but with the caveat of copper diffusing into gold. A barrier like silver is